To produce photomasks for direct exposures of wafers and/or other substrates. Performing various applications such as MEMS, BIOMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, CGHs, and all other applications that require microstructures fabrication.

1. Use micro pattern generator for direct writing applications and low volume mask making
2. Real-time autofocus system monitors and correct focus position during exposure area

1. Surface measurement system has 150mm scan length standard
2. Materials characterization for surface roughness and waviness

1. Contour cut pre-printed graphics.
2. Tangential emulation.

1. Supports a wide range of materials, including high-viscosity materials and nanofilters.
2. 2 modes of mixing and deaeration achieve dispersion and deaeration of high-viscosity materials in a small amount of time.

1. Holds a vacuum of 740mm for 24 hours.
2. Vacuum retention valve allows air to enter slowly.
3. Fits plate diameter 141mm.

1. Feature independent vacuum and purge needle valves.
2. Radiant warm-wall heating system optimizes uniformity and conserves chamber space for drying, curing, vacuum embedding and plating applications.

1. UV-LEDs emitting at 365nm in standard configuration.
2. Dimensions: 260 x 260 x 260mm³.

1. UV-LEDs emitting at 365nm in standard configuration.
2. Dimensions: 260 x 260 x 260mm³.

Ensure accurate, homogeneous and stable temperature set points. This digital    hotplate device enables to set temperature ramp for heating and cooling down

To supply minimum air flow and pressure to spin coater or air gun

1. Quiet compressor with a noise level below 45 dB (A)
2. Tolerance between piston and the cylinder has been reduced, minimizing the heat development and the energy loss